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Tuesday, November 21, 2023

MediaTek Dimensity 8300 brings Armv9 CPU, 60% quicker GPU and Generative AI capabilities

MediaTek introduced its newest 8000-series chipset with the Dimensity 8300. The brand new SoC is fabed on TSMC’s second-generation 4nm course of and comes as a direct successor to final yr’s Dimensity 8200 providing efficiency upgrades throughout the board.

MediaTek Dimensity 8300

MediaTek Dimensity 8300

Dimensity 8300 options 4x Arm Cortex-A715 efficiency cores clocked at as much as 3.35GHz alongside 4x Arm Cortex-A510 effectivity models at as much as 2.2GHz clock speeds. All eight cores are based mostly on the Armv9 CPU structure and MediaTek claims as much as 20% quicker CPU efficiency and 30% peak beneficial properties in energy effectivity in comparison with the outgoing Dimensity 8200.

Dimensity 8300 Dimensity 8200 Dimensity 8100
Node 4 nm 4 nm 5 nm
CPU Prime 1x Cortex-A715 @ 3.35 GHz 1x Cortex-A78 @ 3.1 GHz
CPU Huge 3x Cortex-A715 @ 3.0 GHz 4x Cortex-A78 @ 3.0 GHz 4x Cortex-A78 @ 2.85 GHz
CPU Little 4x Cortex-A510 @ 2.2 GHz 4x Cortex-A55 @ 2.0 GHz 4x Cortex-A55 @ 2.0 GHz
RAM LPDDR5X (as much as 8,533Mbps) LPDDR5 (as much as 6,400 Mbps) LPDDR5 (as much as 6,400 Mbps)
Storage UFS 4.0 with MCQ UFS 3.1 UFS 3.1
GPU Mali-G615 (60% quicker than 8200) Mali-G610 MC6 Mali-G610 MC6
Show FHD+ @ 180Hz, WQHD+ @ 120Hz FHD+ @ 168 Hz, WQHD+ @ 120 Hz FHD+ @ 180Hz, WQHD+ @ 120Hz
Digicam (stills) 320 MP 320 MP 200 MP
Digicam (video) 4K @ 60 fps (HDR10+) 4K @ 60 fps (HDR10+) 4K @ 60 fps (HDR10+)
5G 5.17 Gbps downlink 4.7 Gbps downlink 4.7 Gbps downlink
Wi-Fi Wi-Fi 6E (2×2) Wi-Fi 6E (2×2) Wi-Fi 6E (2×2)
Bluetooth 5.4 5.3 5.3

The brand new chip additionally boasts an Arm Mali-G615 MC6 GPU which brings as much as 60% efficiency beneficial properties and 55% improved energy effectivity at peak speeds in comparison with its predecessor. MediaTek can be claiming as much as 17% quicker app chilly launch and as much as 47% quicker app launch from standby with the brand new chip. The brand new chip additionally helps Quad-channel LPDDR5X RAM at 8,533Mbps speeds and UFS 4.0 storage with Multi-Round Queue (MCQ) assist.

The APU 780 inside Dimensity 8300 makes it the primary chip in its class to assist Generative AI with steady diffusion and assist for LLM with as much as 10 billion parameters. The Imagiq 980 ISP helps as much as 320MP digital camera sensors and 4K video recording at 60fps.

Dimensity 8300 breakdown

Dimensity 8300 breakdown

Dimensity 8300 options an built-in 5G modem with assist for dual-mode 5G and as much as 5.17Gbps downlink on sub-6GHz networks. The chip is alsow outfitted with Wi-Fi 6E and Bluetooth 5.4 connectivity.

Xiaomi already confirmed that its Redmi K70E will debut the Dimensity 8300 later this month.


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